Adhesion and Failure Analysis of Metal-Polymer Interface in Flexible Printed Circuits Boards

S. Park, Y. C. Kim, K. Choi, H. Chae, J. Suhr, J.-D. Nam, “Adhesion and Failure Analysis of Metal-Polymer Interface in Flexible Printed Circuits Boards”, Journal of the Korean Physical Society, 71, 1019-1026, 2017.12