A nanoclustered ceria abrasives with low crystallinity and high Ce3+/Ce4+ ratio for scratch reduction and high oxide removal rates in the chemical mechanical planarization

N.-Y. Kim, G. Kim, H. Sun, U. Hwang, J. Kim, D. Kwak, I.-K. Park, T. Kim, J. Suhr, J.-D. Nam,”A nanoclustered ceria abrasives with low crystallinity and high Ce3+/Ce4+ ratio for scratch reduction and high oxide removal rates in the chemical mechanical planarization”,Journal of Materials Science,12318-12328,2022.06.27